Why many IC package company and Semiconduct company need to IC test?
Why many IC package company and Semiconduct company need to IC test?
Why this person write this title?
In fact,I think many friends will ask me this questions.
" IC test " this word will run through the life of a chip.When a chip have been a idea in his father or mother( engineer man or engineer woman),the IC test is beginning.
When it is a Wafer cell,it need to be test and check its grade(good die or other).The wafer test is to perform a needle test on each die on the wafer. The test head is equipped with a gold wire to make a hair-like probe, which is in contact with the pads on the die, and the electrical test is performed. Characteristic, unqualified grains will be marked, and then when the wafer is cut into individual grains according to the grain unit, the unqualified grains marked with marks will be eliminated, and the next process will not be performed.In order to not increase its manufacturing costs.
The good wafer cell will be package into a chip.As we know,the chip is designed for the specific purpose.So when you make the first sample,you need to use the IC function test socket and failure analysis test socket to check its work on the demo board.For many test,it will become a perfect solution.then chip will go to Small batch test.when it is ok,the socket will be mass production.When the production is processing,the production test is coming.
The production test is for mass auto machine test.The step is mainly tested this IC good or not,and divide good chip and bad chip,the bad one will be stopped their life.The good one will go to the next step-burn in test for confirmed its service life.
About the IC service life,many company have their own standard to be used to determine the quality of the product.
Burn-in test is the process by which components of a system are exercised prior to being placed in service (and often, prior to the system being completely assembled from those components). This testing process will force certain failures to occur under supervised conditions so an understanding of load capacity of the product can be established.
The intention is to detect those particular components that would fail as a result of the initial, high-failure rate portion of the bathtub curve of component reliability. If the burn-in period is made sufficiently long (and, perhaps, artificially stressful), the system can then be trusted to be mostly free of further early failures once the burn-in process is complete.
Theoretically, any weak components would fail during the "Burn In" time allowing those parts to be replaced. Replacing the weak components would prevent premature failure, infant mortality failure, or other latent defects.[1]
When the equivalent lifetime of the stress is extended into the increasing part of the bathtub-like failure-rate curve, the effect of the burn-in is a reduction of product lifetime. In a mature production it is not easy to determine whether there is a decreasing failure rate. To determine the failure time distribution for a very low percentage of the production, one would have to destroy a very large number of devices. By stressing all devices for a certain burn-in time the devices with the highest failure rate fail first and can be taken out of the cohort. Thus by applying a burn-in, early in-use system failures can be avoided at the expense (tradeoff) of a reduced yield caused by the burn-in process.
When possible, it is better to eliminate the root cause of early failures than doing a burn-in. Because of this, a process that initially uses burn-in may eventually phase it out as the various root causes for failures are identified and eliminated.
For electronic components, burn-in is frequently conducted at elevated temperature and perhaps elevated voltage. This process may also be called heat soaking. The components may be under continuous test or simply tested at the end of the burn-in period.
There is another use of the term by some audiophiles, who leave new audio equipment turned on for multiple days or weeks, to get the components to achieve optimal performance. However, many debates have arisen about the benefits of this practice. (burn in test definition is quoted from https://en.wikipedia.org/wiki/Burn-in ).
The all step is over,this chip is finished its birth.and go to the next place to welcome its newborn.
Why this person write this title?
In fact,I think many friends will ask me this questions.
" IC test " this word will run through the life of a chip.When a chip have been a idea in his father or mother( engineer man or engineer woman),the IC test is beginning.
When it is a Wafer cell,it need to be test and check its grade(good die or other).The wafer test is to perform a needle test on each die on the wafer. The test head is equipped with a gold wire to make a hair-like probe, which is in contact with the pads on the die, and the electrical test is performed. Characteristic, unqualified grains will be marked, and then when the wafer is cut into individual grains according to the grain unit, the unqualified grains marked with marks will be eliminated, and the next process will not be performed.In order to not increase its manufacturing costs.
The good wafer cell will be package into a chip.As we know,the chip is designed for the specific purpose.So when you make the first sample,you need to use the IC function test socket and failure analysis test socket to check its work on the demo board.For many test,it will become a perfect solution.then chip will go to Small batch test.when it is ok,the socket will be mass production.When the production is processing,the production test is coming.
The production test is for mass auto machine test.The step is mainly tested this IC good or not,and divide good chip and bad chip,the bad one will be stopped their life.The good one will go to the next step-burn in test for confirmed its service life.
About the IC service life,many company have their own standard to be used to determine the quality of the product.
The intention is to detect those particular components that would fail as a result of the initial, high-failure rate portion of the bathtub curve of component reliability. If the burn-in period is made sufficiently long (and, perhaps, artificially stressful), the system can then be trusted to be mostly free of further early failures once the burn-in process is complete.
Theoretically, any weak components would fail during the "Burn In" time allowing those parts to be replaced. Replacing the weak components would prevent premature failure, infant mortality failure, or other latent defects.[1]
When the equivalent lifetime of the stress is extended into the increasing part of the bathtub-like failure-rate curve, the effect of the burn-in is a reduction of product lifetime. In a mature production it is not easy to determine whether there is a decreasing failure rate. To determine the failure time distribution for a very low percentage of the production, one would have to destroy a very large number of devices. By stressing all devices for a certain burn-in time the devices with the highest failure rate fail first and can be taken out of the cohort. Thus by applying a burn-in, early in-use system failures can be avoided at the expense (tradeoff) of a reduced yield caused by the burn-in process.
When possible, it is better to eliminate the root cause of early failures than doing a burn-in. Because of this, a process that initially uses burn-in may eventually phase it out as the various root causes for failures are identified and eliminated.
For electronic components, burn-in is frequently conducted at elevated temperature and perhaps elevated voltage. This process may also be called heat soaking. The components may be under continuous test or simply tested at the end of the burn-in period.
There is another use of the term by some audiophiles, who leave new audio equipment turned on for multiple days or weeks, to get the components to achieve optimal performance. However, many debates have arisen about the benefits of this practice. (burn in test definition is quoted from https://en.wikipedia.org/wiki/Burn-in ).
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